{"id":8604,"date":"2026-10-13T06:10:58","date_gmt":"2026-10-13T06:10:58","guid":{"rendered":"https:\/\/www.fidelsoftech.com\/news-and-blogs\/?p=8604"},"modified":"2026-10-13T06:11:01","modified_gmt":"2026-10-13T06:11:01","slug":"semiconductor-ecosystem-conference-2026","status":"publish","type":"post","link":"https:\/\/www.fidelsoftech.com\/news-and-blogs\/semiconductor-ecosystem-conference-2026","title":{"rendered":"Fidel at the Semiconductor Ecosystem Conference (SEC-2026)"},"content":{"rendered":"\n[et_pb_section fb_built=&#8221;1&#8243; fullwidth=&#8221;on&#8221; _builder_version=&#8221;4.27.4&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_fullwidth_image src=&#8221;https:\/\/www.fidelsoftech.com\/news-and-blogs\/wp-content\/uploads\/2026\/10\/Fidel-at-the-Semiconductor-Ecosystem-Conference.webp&#8221; alt=&#8221;Fidel at the Semiconductor Ecosystem Conference&#8221; _builder_version=&#8221;4.27.8&#8243; _module_preset=&#8221;default&#8221; custom_margin=&#8221;||||false|false&#8221; global_colors_info=&#8221;{}&#8221;][\/et_pb_fullwidth_image][\/et_pb_section][et_pb_section fb_built=&#8221;1&#8243; fullwidth=&#8221;on&#8221; _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; custom_margin=&#8221;2px||0px||false|false&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_fullwidth_post_title meta=&#8221;off&#8221; featured_image=&#8221;off&#8221; _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; custom_margin=&#8221;0px||||false|false&#8221; custom_padding=&#8221;30px||||false|false&#8221; global_colors_info=&#8221;{}&#8221;][\/et_pb_fullwidth_post_title][\/et_pb_section][et_pb_section fb_built=&#8221;1&#8243; _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; custom_padding=&#8221;25px||13px||false|false&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_row module_class=&#8221;inner-page&#8221; _builder_version=&#8221;4.27.0&#8243; _module_preset=&#8221;default&#8221; custom_padding=&#8221;0px||||false|false&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_column type=&#8221;4_4&#8243; _builder_version=&#8221;4.18.0&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_text _builder_version=&#8221;4.27.8&#8243; _module_preset=&#8221;default&#8221; hover_enabled=&#8221;0&#8243; global_colors_info=&#8221;{}&#8221; sticky_enabled=&#8221;0&#8243;]<p>12\/10\/2026<\/p>\n<p>Fidel Softech participated in the <strong>Semiconductor Ecosystem Conference (SEC-2026)<\/strong>, held on <strong>9 October 2026<\/strong> at the <strong>MCCIA Trade Tower, Pune<\/strong>. Organized around the theme <strong>\u201cFrom Semicon 2.0 to Business Opportunities for Industry,\u201d<\/strong> the conference brought together semiconductor industry leaders, technology experts, manufacturers, policymakers, and ecosystem stakeholders to discuss India&#8217;s growing semiconductor and electronics manufacturing landscape. The event focused on translating policy initiatives into business opportunities and accelerating the development of India&#8217;s semiconductor ecosystem.<\/p>\n<p>The conference aimed to explore opportunities across the semiconductor value chain, from chip design and embedded electronics to manufacturing, supply chains, capital equipment, AI infrastructure, and workforce development. Industry discussions highlighted the importance of strengthening domestic manufacturing capabilities, encouraging investment, supporting innovation, and building a skilled workforce to help India expand its role in the global semiconductor industry.<\/p>\n<h2>Exploring Opportunities Across the Semiconductor Ecosystem<\/h2>\n<p>The sessions offered insights into semiconductor design, embedded electronics, electronic manufacturing services (EMS), passive components, printed circuit boards (PCBs), semiconductor capital equipment, data centres, AI infrastructure, and technical skilling. Discussions also emphasized the importance of hardware-software integration, supply chain development, intellectual property protection, and localized manufacturing. The conference highlighted the growing need for collaboration between technology providers, manufacturers, and engineering talent to support the industry&#8217;s transition from policy development to large-scale implementation.<\/p>\n<p>At Fidel, we highlighted our <a href=\"https:\/\/www.fidelsoftech.com\/hi-tech-solutions\/\">Hi-Tech Solutions<\/a> capabilities and the opportunities to support India&#8217;s expanding semiconductor and electronics ecosystem. Our focus areas include embedded systems, software engineering, AI solutions, computer vision, and <a href=\"https:\/\/www.fidelproducts.com\/\" target=\"_blank\" rel=\"noopener\">smart factory integration<\/a>. With our experience connecting Japanese technology with Indian engineering, we also see opportunities to support Japanese equipment vendors through bilingual technical capabilities and technology integration. These capabilities can help address the software, engineering, and cross-border coordination requirements associated with advanced manufacturing and semiconductor infrastructure.<\/p>\n<h2>Building Connections Across Technology and Manufacturing<\/h2>\n<p>The Semiconductor Ecosystem Conference provided an opportunity to understand emerging industry requirements and explore how technology capabilities can contribute to semiconductor manufacturing, electronics engineering, and AI infrastructure development. Discussions around India&#8217;s manufacturing growth also reinforced the importance of secure engineering workflows, reliable software systems, specialized technical talent, and collaboration across international technology ecosystems. These areas align with our focus on supporting businesses through technology engineering and cross-border expertise.<\/p>\n<p>Fidel was represented at the Semiconductor Ecosystem Conference&nbsp;by <strong>Deepak Joshi, AVP \u2013 Hi-Tech Solutions<\/strong> who attended the conference representing our Hi-Tech Solutions division. The event offered an opportunity to engage with industry stakeholders, exchange perspectives on emerging semiconductor and electronics opportunities, and explore areas where our engineering capabilities and <strong>India\u2013Japan<\/strong> technology connections can contribute to the evolving ecosystem.<\/p>\n<p>The Semiconductor Ecosystem Conference 2026 provided valuable perspectives on India&#8217;s semiconductor ambitions and the opportunities emerging across the electronics manufacturing value chain. Through our participation, we strengthened our understanding of industry priorities and explored how our Hi-Tech Solutions capabilities can support developments in embedded electronics, AI infrastructure, smart manufacturing, and technology integration.<\/p>\n<p>As India continues to expand its semiconductor and electronics manufacturing capabilities, we look forward to contributing through our engineering expertise, technology solutions, and cross-border technology connections<br>For more information about Fidel&#8217;s services or collaboration opportunities, please reach out to us at <a href=\"sales@fidelsoftech.com.\">sales@fidelsoftech.com<\/a>.<\/p>[\/et_pb_text][et_pb_text _builder_version=&#8221;4.27.8&#8243; _module_preset=&#8221;default&#8221; custom_margin=&#8221;||10px||false|false&#8221; locked=&#8221;off&#8221; global_colors_info=&#8221;{}&#8221;]<p>Ref. 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Pune. Organized around the theme \u201cFrom Semicon 2.0 to Business Opportunities for Industry,\u201d the conference brought together semiconductor industry leaders, technology experts, manufacturers, policymakers, and ecosystem stakeholders to discuss India&#8217;s growing semiconductor and electronics manufacturing [&hellip;]<\/p>\n","protected":false},"author":8,"featured_media":8613,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_et_pb_use_builder":"on","_et_pb_old_content":"","_et_gb_content_width":"2880","footnotes":""},"categories":[14],"tags":[],"class_list":["post-8604","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news-and-events"],"_links":{"self":[{"href":"https:\/\/www.fidelsoftech.com\/news-and-blogs\/wp-json\/wp\/v2\/posts\/8604","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.fidelsoftech.com\/news-and-blogs\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.fidelsoftech.com\/news-and-blogs\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.fidelsoftech.com\/news-and-blogs\/wp-json\/wp\/v2\/users\/8"}],"replies":[{"embeddable":true,"href":"https:\/\/www.fidelsoftech.com\/news-and-blogs\/wp-json\/wp\/v2\/comments?post=8604"}],"version-history":[{"count":9,"href":"https:\/\/www.fidelsoftech.com\/news-and-blogs\/wp-json\/wp\/v2\/posts\/8604\/revisions"}],"predecessor-version":[{"id":8619,"href":"https:\/\/www.fidelsoftech.com\/news-and-blogs\/wp-json\/wp\/v2\/posts\/8604\/revisions\/8619"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.fidelsoftech.com\/news-and-blogs\/wp-json\/wp\/v2\/media\/8613"}],"wp:attachment":[{"href":"https:\/\/www.fidelsoftech.com\/news-and-blogs\/wp-json\/wp\/v2\/media?parent=8604"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.fidelsoftech.com\/news-and-blogs\/wp-json\/wp\/v2\/categories?post=8604"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.fidelsoftech.com\/news-and-blogs\/wp-json\/wp\/v2\/tags?post=8604"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}